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Recycling Method for Noble Metal Liners

     

Cleaning and Recycling Method for Noble Metal Liners In the manufacturing process of semiconductor chips, the cleaning and recycling method for noble metal liners proceeds as follows: first, the environment-friendly gold-leaching reagent solution and alkaline agents are purified, followed by complete dissolution of the surface gold plating.

Next, dissolution of other plated metals is conducted to complete the stripping of the plating layers; finally, gold is extracted and recovered, and the liner substrate undergoes ultrasonic non-destructive cleaning. The liner substrate is then dried under vacuum, and after passing the surface appearance quality inspection, it is packaged in vacuum and stored in the warehouse.

This method features the advantages of achieving noble metal recovery without damaging the liner substrate, simple and efficient operation, and safe and environmentally friendly working procedures.

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